Photolithography System (Mask Aligner)

Photolithography System (Mask Aligner) SÜSS MicroTec, MA6 Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Mask Aligner MA 6 Location:ZMNT, Room 009 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description: Mask Aligner and Bond Aligner, UV NIL Tooling

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Wet Bench for Resist Coating

Wet Bench for Resist Coating Arias Usage Modus Operandi:User-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Litho-Bench 1 Location:ZMNT, Room 009 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description: Hotplate small, medium, big (Gestigkeit), Spin Coater RC8 (SÜSS MicroTec, RC8 )

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Electron-Beam Evaporation System

Electron-Beam Evaporation System Leybold, A700QE Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Box Coater Leybold A700QE (Electron-Beam) Location:ZMNT, Room 007 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description:Materials: Au, Cr, Ti, Cu, Al, on demand

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Sputtering System

Sputtering System Nordiko, NS 2550 Duisburg Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Nordiko (Duisburg) Location:ZMNT, Room 007 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description:Targets: Ti, Pl, Iridium, on demand

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Sputtering System

Sputtering System Nordiko, NS 2550 Berlin Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Nordiko (Berlin) Location:ZMNT, Room 007 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description: Targets: Ti, Au, changing, on demand

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Reactive-Ion Etching System

Reactive-Ion Etching System Oxford Instruments, RIE 80 Usage Modus Operandi:User-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- RIE (RIE 80) Location:ZMNT, Room 006 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description:Etching gases: N2, O2, CHF3, CF4, SF6, Ar

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Inductively-Coupled Plasma Reactive Ion Etching System

Inductively-Coupled Plasma Reactive Ion Etching System Oxford Instruments, PlasmaLab System 100 Usage Modus Operandi:Service-Mode Contamination category:Chamber 1: AChamber 2: B Sample-size:up to 6″ substrates; 6″ dummy wafer for samples FOM-Name and Location FOM-Name:- AMO – RIE1 Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: ICP-RIE; automatic 2 chamber system; mainly chlorine and […]

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Atomic Layer Deposition Tool

Atomic Layer Deposition Tool Oxford Instruments, FlexAL Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:up to 8″ wafers; 8″ dummy wafer for samples FOM-Name and Location FOM-Name:- AMO – ALD Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: Materials: AlN, Al2O3, TaN, TiN; process gases: N2, H2, O2, SF6, Ar, NH3, H2O; Wafer stage […]

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