Inductively-Coupled Plasma Reactive Ion Etching System

Oxford Instruments, PlasmaLab System 100 Modus Operandi:Service-ModeContamination category:Chamber 1: AChamber 2: BSample-size:up to 6″ substrates; 6″ dummy wafer for samples FOM-Name:- AMO – RIE1Location:AMO Tool manager: AMO Instruction video: Not available Tool description: ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, […]

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RIE (RIE-51)

MRC, RIE-51 Modus Operandi:User-modeContamination category: A, B, CSample-size:Pieces … 4″ FOM-Name:RIE 51Location:WSH, Room 24B131 Tool manager: Birger Berghoff Instruction video: Open video Tool description: SF6, CHF3, O2 and BCl3 based etching

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ICP-RIE (Fluorian)

SENTECH, ICP-RIE SI 500 Modus Operandi: …Contamination category: CSample-size: Pieces … 4″ FOM-Name:ICP-RIE (Fluorian)Location:CMNT, Room 004 Tool manager:Jan GruisInstruction video:Open videoTool description:SENTECH ICP-RIE SI500Flourine-based process gases

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DRIE (Cobra)

Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System Modus Operandi:User-modeContamination category: A, BSample-size:Pieces … 4″ wafers,8″ wafers possible with small modifications FOM-Name: ICP-DRIE EtcherLocation: CMNT, Room 006 Tool manager: Birger Berghoff Instruction video: Open video Tool description: 

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