Reactive-Ion Etching System

Reactive-Ion Etching System Oxford Instruments, RIE 80 Usage Modus Operandi:User-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- RIE (RIE 80) Location:ZMNT, Room 006 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description:Etching gases: N2, O2, CHF3, CF4, SF6, Ar

Read More

Inductively-Coupled Plasma Reactive Ion Etching System

Inductively-Coupled Plasma Reactive Ion Etching System Oxford Instruments, PlasmaLab System 100 Usage Modus Operandi:Service-Mode Contamination category:Chamber 1: AChamber 2: B Sample-size:up to 6″ substrates; 6″ dummy wafer for samples FOM-Name and Location FOM-Name:- AMO – RIE1 Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: ICP-RIE; automatic 2 chamber system; mainly chlorine and […]

Read More

RIE (RIE-51)

Parallel-Plate Reactive Ion Etching Tool MRC, RIE-51 Usage Modus Operandi:User-mode Contamination category: A, B, C Sample-size:Pieces … 4″ FOM-Name and Location FOM-Name:RIE 51 Location:WSH, Room 24B131 Resources Tool manager: Birger Berghoff Instruction video: Open video Tool description: SF6, CHF3, O2 and BCl3 based etching

Read More

ICP-RIE (Fluorian)

Inductively Coupled Plasma Reactive-Ion Etcher SENTECH, ICP-RIE SI 500 Usage Modus Operandi: … Contamination category: C Sample-size: Pieces … 4″ FOM-Name and Location FOM-Name:ICP-RIE (Fluorian) Location:CMNT, Room 004 Resources Tool manager:Jan Gruis Instruction video:Open video Tool description:SENTECH ICP-RIE SI500Flourine-based process gases

Read More

Plasma Asher (PP35)

Plasma Asher Alpha Plasma, PP35 Usage Modus Operandi:User-mode Contamination category: C Sample-size:Pieces … 4″ FOM-Name and Location FOM-Name:- Physik – Plasma Asher Location:Physikzentrum, Room 28A313 Resources Tool manager: Lars Schreiber Instruction video: Open video Tool description: Alpha Plasma, PP35

Read More

Plasma Asher (Tegal, 915)

Plasma Asher Tegal, 915 Usage Modus Operandi:User-mode Contamination category: B,C (B if appropriate handling wafer is used) Sample-size:Pieces … 6″ wafers FOM-Name and Location FOM-Name:N.N. Location:CMNT, Room 009 Resources Tool manager: Jochen Heiss Instruction video: Open video Tool description: Tegal, 915

Read More

Plasma Asher/SF6 Plasma Etcher

Barrel Plasma Asher/SF6 Plasma Etcher Oxford Instruments, Plasmalab PRS 90 Usage Modus Operandi:User-mode Contamination category:B,C if appriate handle wafers are used Sample-size:Pieces … 6″ wafers FOM-Name and Location FOM-Name:– IHT – Plasma Asher Location:WSH, Room 24B132 Resources Tool manager: Birger Berghoff Instruction video: Open video Tool description: 

Read More

DRIE (Cobra)

Inductively Coupled Plasma Deep Reactive-Ion Etching System Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System Usage Modus Operandi:User-mode Contamination category: A, B Sample-size:Pieces … 4″ wafers,8″ wafers possible with small modifications FOM-Name and Location FOM-Name: ICP-DRIE Etcher Location: CMNT, Room 006 Resources Tool manager: Birger Berghoff Instruction video: Open video Tool description: 

Read More