Photolithography System (Mask Aligner)

Photolithography System (Mask Aligner) SÜSS MicroTec, MA6 Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Mask Aligner MA 6 Location:ZMNT, Room 009 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description: Mask Aligner and Bond Aligner, UV NIL Tooling

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Wet Bench for Resist Coating

Wet Bench for Resist Coating Arias Usage Modus Operandi:User-Mode Contamination category:C Sample-size:100 mm, 150 mm Wafer FOM-Name and Location FOM-Name:- Litho-Bench 1 Location:ZMNT, Room 009 Resources Tool manager: Jochen Heiss Instruction video: Not available Tool description: Hotplate small, medium, big (Gestigkeit), Spin Coater RC8 (SÜSS MicroTec, RC8 )

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Wet Bench for Lithography Processes

Wet Bench for Lithography Processes Arias Usage Modus Operandi:Service-Mode Contamination category:B Sample-size:wide range of sample and wafer sizes up to 8″ FOM-Name and Location FOM-Name:- AMO – Wet Bench Lithography Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: Single wafer, batch and samples; cleaning and resist processes

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Interference Lithography System

Interference Lithography System Self-made Usage Modus Operandi:Service-Mode Contamination category:B Sample-size:4″, 6″, 8″ and every rectangular shape within FOM-Name and Location FOM-Name:- AMO – Interference Lithography System Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: 180 nm – 2.5 μm pitch; stitching free gratings

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Automatic Resist Coater and Developer

Automatic Resist Coater and Developer EVG, 150 Usage Modus Operandi:Service-Mode Contamination category:B Sample-size:4″ – 8″ wafers FOM-Name and Location FOM-Name:- AMO – Automatic Resist Coater and Developer Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: 4″- 8″ automatic resist coater and developer; AZ MiR701, Primer, AZ5214E

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Photolithography System (Mask Aligner)

Photolithography System (Mask Aligner) EVG, 420 Usage Modus Operandi:Service-Mode Contamination category:C Sample-size:from samples of 10×10 mm² up to 6″ wafers FOM-Name and Location FOM-Name:- AMO – Mask Aligner (EVG 420) Location:AMO Resources Tool manager: AMO Instruction video: Not available Tool description: 6″ semi-automatic mask aligner; 2 µm resolution

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Mask Aligner (MJB3)

Photolithography System SÜSS MicroTec, MJB3 Usage Modus Operandi:User-mode Contamination category: B, C Sample-size:Pieces … 3″ FOM-Name and Location FOM-Name:- Physik – Photolithography System (MJB3) Location:Physikzentrum, Room 28A313 Resources Tool manager: Arne Hollmann Instruction video: Open video Tool description: SÜSS MicroTec, MJB3

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Wet Benches Solvents, Resists, Developers

Wet Benches for Solvents, Resists and Developers Usage Modus Operandi:User-mode Contamination category: C Sample-size:Pieces … 4″ FOM-Name and Location FOM-Name: – Physik – Wet Benches Location: Physikzentrum, Room 28A313 Resources Tool manager:Natalie Bruger Instruction video:Open video Tool description:Three wet benches for solvents (isopropanol, acetone), resists (incl. spinner and hotplates) and developers.

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