Wafer Bonder (SB6e)

Wafer Bonder SÜSS MicroTec, SB6e Usage Modus Operandi:User-mode Contamination category: B,C if appropriate handling tools are used Sample-size:6″ wafers FOM-Name and Location FOM-Name:N.N. Location:CMNT, Room 006 Resources Tool manager: Jochen Heiss Instruction video: Open video Tool description: SÜSS MicroTec, SB6e

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MA_BA6

Photolithography System (Mask Aligner / Bond Aligner) SÜSS MicroTec, MA/BA6 Usage Modus Operandi:User-mode Contamination category: A,B,C if appropriate chuck and masks are used Sample-size:Pieces … 6″ wafer FOM-Name and Location FOM-Name:Optical Lithography (MABA6) Location:CMNT, Room 009 Resources Tool manager: Birger Berghoff Instruction video: Open video Tool description: Top- and back-side alignment

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