Inductively-Coupled Plasma Reactive Ion Etching System

Inductively-Coupled Plasma Reactive Ion Etching System

Oxford Instruments, PlasmaLab System 100

Usage

  • Modus Operandi:
    Service-Mode
  • Contamination category:
    Chamber 1: A
    Chamber 2: B
  • Sample-size:
    up to 6″ substrates; 6" dummy wafer for samples

FOM-Name and Location

  • FOM-Name:
    - AMO - RIE1
  • Location:
    AMO

Resources

  • Tool manager:
    AMO
  • Instruction video:
    Not available
  • Tool description:
    ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, Ar, He