Wafer Bonding

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  • Wafer Bonder

    SÜSS MicroTec, SB6e

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B,C if appropriate handling tools are used
    • Sample-size:
      6″ wafers
    Wafer Bonder

    FOM-Name and Location

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Open video
    • Tool description:
      SÜSS MicroTec, SB6e
    Continue reading →
  • Photolithography System (Mask Aligner / Bond Aligner)

    SÜSS MicroTec, MA/BA6

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B,C if appropriate chuck and masks are used
    • Sample-size:
      Pieces ... 6″ wafer

    FOM-Name and Location

    Resources

    Continue reading →

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