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Photolithography System (Mask Aligner)
SÜSS MicroTec, MA6
Usage
- Modus Operandi:
Service-Mode - Contamination category:
C - Sample-size:
100 mm, 150 mm Wafer
FOM-Name and Location
- FOM-Name:
- Mask Aligner MA 6 - Location:
ZMNT, Room 009
Resources
- Tool manager:
Jochen Heiss - Instruction video:
Not available - Tool description:
Mask Aligner and Bond Aligner, UV NIL Tooling
- Modus Operandi:
- Continue reading →
Wet Bench for Imprint Processes
Arias
Usage
- Modus Operandi:
Service-Mode - Contamination category:
B and C (dedicated halves) - Sample-size:
pieces - 8" wafers
FOM-Name and Location
- FOM-Name:
- AMO - Went Bench Imprint - Location:
AMO
Resources
- Tool manager:
AMO - Instruction video:
Not available - Tool description:
wet bench right (class C), carrier left (class B)
- Modus Operandi:
- Continue reading →
SCIL UV Nanoimprint Lithography System
SÜSS MicroTec, MA8 Gen3
Usage
- Modus Operandi:
Service-Mode - Contamination category:
B - Sample-size:
2" - 8" wafers
FOM-Name and Location
- FOM-Name:
- AMO - SCIL UV Nanoimprint - Location:
AMO
Resources
- Tool manager:
AMO - Instruction video:
Not available - Tool description:
SCIL 2″-8″ UV-Nanoimprint Lithography
- Modus Operandi:
- Continue reading →
Soft UV Nanoimprint Lithography Prototype System
EVG, 620
Usage
- Modus Operandi:
Service-Mode - Contamination category:
B - Sample-size:
4"- 6" flexible template size
FOM-Name and Location
- FOM-Name:
- AMO - Soft UV Nanoimprint - Location:
AMO
Resources
- Tool manager:
AMO - Instruction video:
Not available - Tool description:
Soft UV Nanoimprint prototype
- Modus Operandi:
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