Photolithography

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• Wet Bench for Solvents and Resist Development

  Arias

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A, B
  • Sample-size:
    Pieces ... 6″ wafers

  

  FOM-Name and Location

  • FOM-Name:
    Wet Bench Solvents and Resist Development
  • Location:
    CMNT, Room 001

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description: 
  Continue reading →

• Wet Bench for Resist and HMDS Coating

  Arias

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A, B, C if appropriate handle wafer and chucks are used
  • Sample-size:
    Pieces ... 6″ wafer

  

  FOM-Name and Location

  • FOM-Name:
    Wet Bench Resist Coating
  • Location:
    CMNT, Room 001

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description:
  Continue reading →

• Photolithography System (Mask Aligner)

  SÜSS MicroTec, MA4

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A,B,C if appropriate chucks and masks are used
  • Sample-size:
    Pieces ... 4″

  

  FOM-Name and Location

  • FOM-Name:
    – IHT – Optical Lithography (MA4)
  • Location: WSH, Room 24B103

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description: 
  Continue reading →

• Photolithography System (Mask Aligner / Bond Aligner)

  SÜSS MicroTec, MA/BA6

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A,B,C if appropriate chuck and masks are used
  • Sample-size:
    Pieces ... 6″ wafer

  

  FOM-Name and Location

  • FOM-Name:
    Optical Lithography (MABA6)
  • Location:
    CMNT, Room 009

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description:
    Top- and back-side alignment
  Continue reading →

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