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• Low Pressure Chemical Vapour Deposition Furnace for Low Temperature Silicon Dioxide

  Centrotherm

  Usage

  • Modus Operandi:
    Service-Mode
  • Contamination category:
    A
  • Sample-size:
    up to 25 wafers per run; 9 samples (max. 2x2 cm)

  

  FOM-Name and Location

  • FOM-Name:
    - AMO - LPCVD-LTO
  • Location:
    AMO

  Resources

  • Tool manager:
    AMO
  • Instruction video:
    Not available
  • Tool description:
    LTO (low temp. SiO2); 425°C; SiH4 and O2 process; up to 500 nm
  Continue reading →

• Low Pressure Chemical Vapour Deposition Furnace for Polycrystalline Silicon

  Centrotherm

  Usage

  • Modus Operandi:
    Service-Mode
  • Contamination category:
    A
  • Sample-size:
    up to 25 wafers per run; 15x15 cm tray for samples

  

  FOM-Name and Location

  • FOM-Name:
    - AMO - LPCVD-Poly
  • Location:
    AMO

  Resources

  • Tool manager:
    AMO
  • Instruction video:
    Not available
  • Tool description:
    Polysilicon; 620°C; SiH4 process; up to 500 nm
  Continue reading →

• Photolithography System (Mask Aligner)

  SÜSS MicroTec, MA4

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A,B,C if appropriate chucks and masks are used
  • Sample-size:
    Pieces ... 4″

  

  FOM-Name and Location

  • FOM-Name:
    – IHT – Optical Lithography (MA4)
  • Location: WSH, Room 24B103

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description: 
  Continue reading →

• Photolithography System

  SÜSS MicroTec, MJB3

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: B, C
  • Sample-size:
    Pieces ... 3″

  

  FOM-Name and Location

  • FOM-Name:
    - Physik - Photolithography System (MJB3)
  • Location:
    Physikzentrum, Room 28A313

  Resources

  • Tool manager:
    Arne Hollmann
  • Instruction video:
    Open video
  • Tool description:
    SÜSS MicroTec, MJB3
  Continue reading →

• Photolithography System (Mask Aligner / Bond Aligner)

  SÜSS MicroTec, MA/BA6

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A,B,C if appropriate chuck and masks are used
  • Sample-size:
    Pieces ... 6″ wafer

  

  FOM-Name and Location

  • FOM-Name:
    Optical Lithography (MABA6)
  • Location:
    CMNT, Room 009

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description:
    Top- and back-side alignment
  Continue reading →

• Plasma-Enhanced Chemical Vapor Deposition System

  Oxford Instruments, PlasmaLab 80 Plus

  Usage

  • Modus Operandi:
    ...
  • Contamination category: C
  • Sample-size:
    Pieces ... 4″

  

  FOM-Name and Location

  • FOM-Name:
    PECVD (Petzi)
  • Location:
    CMNT, Room 004

  Resources

  • Tool manager:
    Jan Gruis
  • Instruction video:
    Open video
  • Tool description:
    Oxford Instruments, PlasmaLab 80 Plus
    Parallel-plate PECVD
    Process gases: SiH₄, O₂, NH₃
  Continue reading →

• Photolithography System (Mask Aligner)

  EVG, 420

  Usage

  • Modus Operandi:
    Service-Mode
  • Contamination category:
    C
  • Sample-size:
    from samples of 10×10 mm² up to 6" wafers

  

  FOM-Name and Location

  • FOM-Name:
    - AMO - Mask Aligner (EVG 420)
  • Location:
    AMO

  Resources

  • Tool manager:
    AMO
  • Instruction video:
    Not available
  • Tool description:
    6" semi-automatic mask aligner; 2 µm resolution
  Continue reading →

• Photolithography System (Mask Aligner)

  SÜSS MicroTec, MA6

  Usage

  • Modus Operandi:
    Service-Mode
  • Contamination category:
    C
  • Sample-size:
    100 mm, 150 mm Wafer

  

  FOM-Name and Location

  • FOM-Name:
    - Mask Aligner MA 6
  • Location:
    ZMNT, Room 009

  Resources

  • Tool manager:
    Jochen Heiss
  • Instruction video:
    Not available
  • Tool description:
    Mask Aligner and Bond Aligner, UV NIL Tooling
  Continue reading →

• Photolithography System (Stepper)

  Canon, FPA 3000 i5+

  Usage

  • Modus Operandi:
    Service-Mode
  • Contamination category:
    B
  • Sample-size:
    only 6" wafers; no samples

  

  FOM-Name and Location

  • FOM-Name:
    - AMO - Stepper
  • Location:
    AMO

  Resources

  • Tool manager:
    AMO
  • Instruction video:
    Not available
  • Tool description:
    6" i-line Stepper with 0.5 μm resolution
  Continue reading →

• Plasma Asher

  Alpha Plasma, PP35

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: C
  • Sample-size:
    Pieces ... 4″

  

  FOM-Name and Location

  • FOM-Name:
    - Physik - Plasma Asher
  • Location:
    Physikzentrum, Room 28A313

  Resources

  • Tool manager:
    Lars Schreiber
  • Instruction video:
    Open video
  • Tool description:
    Alpha Plasma, PP35
  Continue reading →

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