All Processing Tools

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  • Plasma Asher

    Tegal, 915

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B,C (B if appropriate handling wafer is used)
    • Sample-size:
      Pieces ... 6″ wafers
    O2 Plasma Asher

    FOM-Name and Location

    • FOM-Name:
      N.N.
    • Location:
      CMNT, Room 009

    Resources

    Continue reading →

  • Barrel Plasma Asher/SF6 Plasma Etcher

    Oxford Instruments, Plasmalab PRS 90

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category:
      B,C if appriate handle wafers are used
    • Sample-size:
      Pieces ... 6″ wafers
    Oxford Barrel Plasma Asher/SF6 Plasma EtcherBruker DEKTAK XT

    FOM-Name and Location

    • FOM-Name:
      – IHT – Plasma Asher
    • Location:
      WSH, Room 24B132

    Resources

    Continue reading →

  • Rapid Thermal Processing Furnace

    Jipelec, JetFirst

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      up to 6" wafers; 6" dummy wafer for samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - RTP
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      6″ Rapid Thermal Annealing system up to 1100°C; process gases H2, N2, Ar
    Continue reading →

  • Reactive-Ion Etching System

    Tegal, 901

    Usage

    • Modus Operandi:
      User-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - RIE (Tegal 901)
    • Location:
      ZMNT, Room 006

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Etching gases: N2, O2, CHF3, CF4, SF6, Ar
    Continue reading →

  • Reactive-Ion Etching System

    Oxford Instruments, RIE 80

    Usage

    • Modus Operandi:
      User-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - RIE (RIE 80)
    • Location:
      ZMNT, Room 006

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Etching gases: N2, O2, CHF3, CF4, SF6, Ar
    Continue reading →

  • Parallel-Plate Reactive Ion Etching Tool

    MRC, RIE-51

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B, C
    • Sample-size:
      Pieces ... 4″
    Parallel-Plate Reactive Ion Etching

    FOM-Name and Location

    • FOM-Name:
      RIE 51
    • Location:
      WSH, Room 24B131

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      SF6, CHF3, O2 and BCl3 based etching
    Continue reading →

  • Rapid Thermal Processing Furnace

    Annealsys, AS-One 150

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B
    • Sample-size:
      Pieces ... 6″ wafers
    AnnealSys AS-One 150 Rapid Thermal Annealing/Oxidation/H2 Anneal/Nitridation

    FOM-Name and Location

    • FOM-Name:
      – IHT – RTP (AS-One 150)
    • Location:
      WSH, Room 24B101

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      Cold-wall RTP with stainless steel chamber,
      high vacuum,
      annealing in pure hydrogen possible,
      process gases: Ar, NH3, O2, H2
    Continue reading →

  • Rapid Thermal Processing Furnace

    UniTemp, RTP 150

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: C
    • Sample-size:
      Pieces ... 6″ wafers
    UniTemp Rapid Thermal Annealing/Oxidation

    FOM-Name and Location

    • FOM-Name:
      – IHT – RTP (RTP 150)
    • Location:
      WSH, Room 24B309

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      Inert gas (Ar) annealing,
      Forming gas annealing,
      Oxidation (O2)
    Continue reading →

  • SCIL UV Nanoimprint Lithography System

    SÜSS MicroTec, MA8 Gen3

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      2" - 8" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - SCIL UV Nanoimprint
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      SCIL 2″-8″ UV-Nanoimprint Lithography
    Continue reading →

  • Single-Wafer Cleaning System

    acp, Corwet 200M

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B
    • Sample-size:
      4″ wafers only
    Single Wafer Cleaning

    FOM-Name and Location

    Resources

    Continue reading →


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