Photolithography

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  • Wet Bench for Solvents and Resist Development

    Arias

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B
    • Sample-size:
      Pieces ... 6″ wafers
    Wet Bench for Solvents and Resist Development

    FOM-Name and Location

    • FOM-Name:
      Wet Bench Solvents and Resist Development
    • Location:
      CMNT, Room 001

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description: 
    Continue reading →

  • Wet Bench for Resist and HMDS Coating

    Arias

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B, C if appropriate handle wafer and chucks are used
    • Sample-size:
      Pieces ... 6″ wafer
    Resist Coating including HMDS

    FOM-Name and Location

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
    Continue reading →

  • Photolithography System (Mask Aligner)

    SÜSS MicroTec, MA4

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B,C if appropriate chucks and masks are used
    • Sample-size:
      Pieces ... 4″

    FOM-Name and Location

    • FOM-Name:
      – IHT – Optical Lithography (MA4)
    • Location: WSH, Room 24B103

    Resources

    Continue reading →

  • Photolithography System (Mask Aligner / Bond Aligner)

    SÜSS MicroTec, MA/BA6

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B,C if appropriate chuck and masks are used
    • Sample-size:
      Pieces ... 6″ wafer

    FOM-Name and Location

    Resources

    Continue reading →


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