Photolithography

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  • Photolithography System (Mask Aligner)

    SÜSS MicroTec, MA6

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Mask Aligner MA 6
    • Location:
      ZMNT, Room 009

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Mask Aligner and Bond Aligner, UV NIL Tooling
    Continue reading →
  • Wet Bench for Resist Coating and Development

    Arias

    Usage

    • Modus Operandi:
      User-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Litho-Bench 2
    • Location:
      ZMNT, Room 009

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Hotplate small, medium, big (Gestigkeit), Spin Coater (Sawatec, SM 180)
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  • Wet Bench for Resist Coating

    Arias

    Usage

    • Modus Operandi:
      User-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Litho-Bench 1
    • Location:
      ZMNT, Room 009

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Hotplate small, medium, big (Gestigkeit), Spin Coater RC8 (SÜSS MicroTec, RC8 )
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  • Wet Bench for Lithography Processes

    Arias

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      wide range of sample and wafer sizes up to 8"

    FOM-Name and Location

    • FOM-Name:
      - AMO - Wet Bench Lithography
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      Single wafer, batch and samples; cleaning and resist processes
    Continue reading →
  • Interference Lithography System

    Self-made

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      4", 6", 8" and every rectangular shape within

    FOM-Name and Location

    • FOM-Name:
      - AMO - Interference Lithography System
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      180 nm – 2.5 μm pitch; stitching free gratings
    Continue reading →
  • Automatic Resist Coater and Developer

    EVG, 150

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      4" - 8" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - Automatic Resist Coater and Developer
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      4″- 8″ automatic resist coater and developer; AZ MiR701, Primer, AZ5214E
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  • Photolithography System (Stepper)

    Canon, FPA 3000 i5+

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      only 6" wafers; no samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - Stepper
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      6" i-line Stepper with 0.5 μm resolution
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  • Photolithography System (Mask Aligner)

    EVG, 420

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      from samples of 10×10 mm² up to 6" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - Mask Aligner (EVG 420)
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      6" semi-automatic mask aligner; 2 µm resolution
    Continue reading →
  • Photolithography System

    SÜSS MicroTec, MJB3

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B, C
    • Sample-size:
      Pieces ... 3″
    Mask Aligner MJB3

    FOM-Name and Location

    • FOM-Name:
      - Physik - Photolithography System (MJB3)
    • Location:
      Physikzentrum, Room 28A313

    Resources

    • Tool manager:
      Arne Hollmann
    • Instruction video:
      Open video
    • Tool description:
      SÜSS MicroTec, MJB3
    Continue reading →
  • Wet Benches for Solvents, Resists and Developers

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: C
    • Sample-size:
      Pieces ... 4″
    Physik Wetbenches

    FOM-Name and Location

    • FOM-Name:
      - Physik - Wet Benches
    • Location:
      Physikzentrum, Room 28A313

    Resources

    • Tool manager:
      Natalie Bruger
    • Instruction video:
      Open video
    • Tool description:
      Three wet benches for solvents (isopropanol, acetone), resists (incl. spinner and hotplates) and developers.
    Continue reading →

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